This 2-layer Rogers TMM3 rigid PCB is a high-performance thermoset microwave circuit board engineered for stable and reliable RF/microwave operation. Fabricated with authentic Rogers TMM3 ceramic thermoset polymer composite substrate, the board features a full finished thickness of 2.54mm and 1 oz (1.4 mils) outer copper weight. It adopts nickel-free EPIG surface finish to deliver superior conductivity and pure signal transmission performance, paired with 20 μm uniform via plating for consistent circuit connectivity. Built with a no-blind-via structure and large 2.5mm minimum hole size, the PCB applies full non-silkscreen and non-solder-mask configuration on both sides.
PCB Specification
| Specification Item | Details |
| Base Material | Rogers TMM3 ceramic thermoset microwave composite |
| Layer Count | 2 layers (rigid PCB) |
| Finished Board Thickness | 2.54mm |
| Board Dimensions | 48.6mm x 50.04mm (1PCS) |
| Finished Copper Weight | 1 oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Minimum Hole Size | 2.5mm |
| Blind Vias | None |
| Surface Finish | EPIG (Nickel-Free) |
| Silkscreen | No top & bottom silkscreen |
| Solder Mask | No top & bottom solder mask |
| Production Standard | IPC-Class-2 |
| Testing Process | 100% electrical test prior to shipment |
This industrial-grade 2-layer rigid PCB structure delivers uniform mechanical stability and consistent electrical performance for high-frequency microwave operation. The symmetrical layer configuration eliminates structural imbalance risks and supports high-yield, reliable fabrication for standard RF circuit applications.
PCB Stack-up Structure:
| Stack-up Layer | Specification Details |
| Copper Layer 1 | 35 μm conductive copper foil |
| TMM3 Substrate Core | 100mil (2.54mm) ceramic thermoset polymer composite core |
| Copper Layer 2 | 35 μm conductive copper foil |
PCB Statistic
| Statistical Item | Quantity |
| Total Components | 1 |
| Total Pads | 1 |
| Thru Hole Pads | 1 |
| Top SMT Pads | 1 |
| Bottom SMT Pads | 0 |
| Vias Quantity | 1 |
| Nets Quantity | 2 |
Rogers TMM3 Material Introduction
Rogers TMM3 is a high-performance ceramic thermoset polymer composite laminate belonging to the TMM thermoset microwave material series. It is engineered for high-reliability plated thru-hole stripline and microstrip microwave circuitry, integrating the core advantages of rigid ceramic substrates and conventional PTFE microwave laminates without requiring complex specialized fabrication techniques.
Formulated with premium thermoset resin systems, TMM3 maintains stable structural rigidity at elevated temperatures and avoids softening deformation. This inherent thermal stability enables reliable wire bonding procedures with zero risks of pad lifting or substrate delamination during electronic packaging processes. The material supports standard PCB manufacturing workflows and requires no sodium napthanate pre-treatment before electroless plating, greatly improving fabrication efficiency and process compatibility.
Superior Electrical & Thermal Properties
| Property | TMM3 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.27±0.032 | Z | | 10 GHz | IPC-TM-650 2.5.5.5 |
| Dielectric Constant,εDesign | 3.45 | - | - | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of dielectric constant | +37 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 |
| Volume Resistivity | 2 x 109 | - | Mohm.cm | - | ASTM D257 |
| Surface Resistivity | >9x 10^9 | - | Mohm | - | ASTM D257 |
| Electrical Strength(dielectric strength) | 441 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 |
| Thermal Properties |
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 |
| Coefficient of Thermal Expansion - x | 15 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Y | 15 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Z | 23 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Thermal Conductivity | 0.7 | Z | W/m/K | 80 ℃ | ASTM C518 |
| Mechanical Properties |
| Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 |
| Flexural Strength (MD/CMD) | 16.53 | X,Y | kpsi | A | ASTM D790 |
| Flexural Modulus (MD/CMD) | 1.72 | X,Y | Mpsi | A | ASTM D790 |
| Physical Properties |
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.06 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.12 |
| Specific Gravity | 1.78 | - | - | A | ASTM D792 |
| Specific Heat Capacity | 0.87 | - | J/g/K | A | Calculated |
| Lead-Free Process Compatible | YES | - | - | - | - |
TMM3 Material Benefits & Advantages
Surpassing standard FR4 and conventional microwave substrates, Rogers TMM3 PCB features outstanding mechanical robustness and full-process fabrication adaptability, ideal for stable long-term high-frequency RF operation.
Excellent mechanical stability: Unique material composition effectively resists creep and cold flow under continuous operating stress
Superior chemical tolerance: Strong resistance to standard PCB process chemicals and etchants, minimizing substrate damage and improving production yield
Simplified metallization workflow: Eliminates sodium napthanate pre-treatment for electroless plating, streamlining manufacturing procedures
High thermal cycling reliability: Copper-matched thermal expansion properties prevent structural fracture and PTH failure during temperature changes
Strict quality control: 100% full electrical inspection after production eliminates functional defects for consistent batch quality
Typical Applications
With ultra-low signal loss, excellent dielectric stability and reliable mechanical durability, TMM3 microwave PCBs are widely deployed in high-precision RF and microwave industrial systems:
- Precision chip testers and industrial testing equipment
- Microwave dielectric polarizers and optical lenses
- RF filters, signal couplers and power divider components
- GPS (Global Positioning System) antenna systems
- High-stability patch antenna assemblies
- RF power amplifiers and combiners
- General high-frequency RF and microwave circuitry
- Commercial and industrial satellite communication systems
Quality & Service Guarantee
All Rogers TMM3 high-frequency PCBs are fabricated in strict compliance with IPC-Class-2 industrial quality standards. Processed with standard Gerber RS-274-X design files, these circuit boards deliver precise dimensional accuracy and stable electrical consistency for professional high-frequency circuitry. Every finished PCB undergoes comprehensive electrical performance verification prior to shipment to ensure zero functional defects. Supported by global logistics and professional technical services, these reliable TMM3 microwave PCB solutions serve industrial manufacturing and high-end R&D scenarios worldwide.
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2-Layer 2.54mm Thick Rogers TMM3 EPIG Finish RF Microwave PCB Images
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